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Semiconductor Burn In Test Pcb Board Fabrication Process 0.3 Pitch 8 Layer

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Topmatch Electronics (Suzhou) Co., Limited.

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Semiconductor Burn In Test Pcb Board Fabrication Process 0.3 Pitch 8 Layer

Name: Semiconductor Burn In Test Pcb Board Fabrication Process 03 Pitch 8 Layer
Brand: TOPCBS
Price: 1 USD

China Semiconductor Burn In Test Pcb Board Fabrication Process 0.3 Pitch 8 Layer wholesale

Brand Name : TOPCBS

Model Number : BIB and test Boards

Certification : UL94V0

Place of Origin : Suzhou China

MOQ : Negotiation

Price : Negotiation

Payment Terms : T/T

Supply Ability : 10000unit per month

Delivery Time : 10-14working days

Packaging Details : 20units per package box size 20*15*10cm

Layer count : 8Layer

Raw material : IT180A

Finished Treatment : Immerion Gold + OSP

Pitch Size : 0.3mm

Board thickness : 0.8mm

Line width/space : 75um/100um

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0.3pitch 8Layer HDI PCBs for Burn in boards and semiconductor Test boards / thin board

A burn-in board is a printed circuit board that is used in the burn-in process.

The components added to the board are stressed using extreme heat to highlight any failures. Once the stress tests have been completed engineers will analyse the results to make sure everything is working within the correct parameters.

During the burn-in process extreme temperatures often ranging from 125°C – 250°C or even 300°C are applied so the materials used need to be extremely durable. Generally speaking we use IS410 for applications up to 155°C and polyimide for applications up to 250°C. For temperatures over 250°C a higher grade of polyimide is used. We also use high temperature lead free solders and stainless-steel board fixtures.

1 . Descriptions:

What is a BIB ?

A burn-in board is a printed circuit board that is used in the burn-in process. The components added to the board are stressed using extreme heat to highlight any failures. Once the stress tests have been completed engineers will analyse the results to make sure everything is working within the correct parameters.

2 . Specifications:

Name	0.3pitch 8Layer HDI PCBs for Burn in boards and semiconductor Test boards
Number of Layers	8
Quality Grade	IPC 6012 Class 2,IPC 6012 Class 3
Material	IT180
Thickness	0.8mm
Min Track/Spacing	75um/75um
Min Hole Size	Laser 75um
Solder Mask	Green
Silkscreen	White
Surface Finish	Immersion gold + OSP
Finished Copper	12um
Production time	10-21 working days
Lead time	2-3 days

Semiconductor Burn In Test Pcb Board Fabrication Process 0.3 Pitch 8 Layer

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Semiconductor Burn In Test Pcb Board Fabrication Process 0.3 Pitch 8 Layer Images

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Semiconductor Burn In Test Pcb Board Fabrication Process 0.3 Pitch 8 Layer

Semiconductor Burn In Test Pcb Board Fabrication Process 0.3 Pitch 8 Layer

Semiconductor Burn In Test Pcb Board

Burn In Test Pcb Board Fabrication Process

Burn-In Testing

Semiconductor Burn In Test Pcb Board Fabrication Process 0.3 Pitch 8 Layer Images